SIDC85D170H datasheet, diode equivalent, Infineon Technologies AG

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Features and benefits

A
* 1700V EMCON 3 technology 200 µm chip This chip is used for:
* soft, fast switching
* EUPEC power modules
* low reverse recovery charge
* sm.

Application

C
* resonant applications, drives Chip Type SIDC85D170H VR IF Die Size 1700V 150A 9.2 x 9.2 mm2 Package Ord.

Description

AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Strasse 53 D-81541 Mün.

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